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An adhesive bonding approach by hydrogen silsesquioxane for www diva-portal org/smash/get/diva2:1281580/FULLTEXT01 pdf 8 nov 2018 Silicon carbide (SiC) has become a popular industrial material in the However the utility of this type of white LED is limited by the
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Low Temperature Hydrophilic SiC Wafer Level Direct Bonding for mdpi-res com/d_attachment/micromachines/micromachines-12-01575/article_deploy/micromachines-12-01575-v2 version=1640049914 17 déc 2021 Abstract: SiC direct bonding using O2 plasma activation is (n-type 4◦ off-axis 4H-SiC wafer) with the thickness of 350 µm and 200 µm
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