Consumer electronics packaging market

What are the techniques used in electronic packaging?
Electronic packaging technology uses a variety of fabrication techniques such as welding, electroplating, and injection molding to accomplish its purposes..
What is the packaging of electronic devices?
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer..
Consumer Electronics Market Size & Trends
The global consumer electronics market size was valued at USD 1,068.22 billion in 2022 and is expected to grow at a compound annual growth rate (CAGR) of 6.6% from 2023 to 2030.
Smartphone proliferation is expected to fuel the global market for consumer electronics.

The Global Consumer Electronics Packaging market is anticipated to rise at a considerable rate during the forecast period, between 2023 and 2030. In 2022, the market is growing at a steady rate and with the rising adoption of strategies by key players, the market is expected to rise over the projected horizon.

The global consumer electronics packaging market was valued at $22.1 billion in 2022, and is projected to reach $49.1 billion by 2032, growing at a CAGR of 8.4%

Is the consumer electronics packaging market restrained by regulations?

The consumer electronics packaging market is projected to be restrained by regulations for the use of plastic

Regulations governing the use of plastic pose a threat to the market growth of plastic-based packaging solutions

What is electronic packaging?

Electronic packaging is the creation and production of sections for electronic gadgets ranging from individual semiconductor devices to complete systems, such as mainframe computers

The Studied Market is Segmented by material types such as Plastic, Metal, and Glass

What is the global consumer electronics packaging market size?

The global consumer electronics packaging market size reached US$ 20

4 Billion in 2022

Looking forward, IMARC Group expects the market to reach US$ 38 Billion by 2028, exhibiting a growth rate (CAGR) of 10

8% during 2023-2028

Integrated circuit packaging method

Package on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages.
Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them.
This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements.
Stacks with more than 2 packages are uncommon, due to heat dissipation considerations.

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Consumer electronics packaging market

What are the techniques used in electronic packaging?

What is the packaging of electronic devices?

Is the consumer electronics packaging market restrained by regulations?

What is electronic packaging?

What is the global consumer electronics packaging market size?