ESC controller. Customized to improve electrostatic clamp operation.


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PDF The Electrostatic Semiconductor Wafer Clamping/Chucking System

The Optimizer provides hardware and software to allow the ESC system tool manufacturer to quickly and easily develop and evaluate the clamping performance 

  • How does electrostatic clamping work?

    Clamping/Chucking System (ESC)
    ESCs employ a platen with integral electrodes which are biased with high voltage to establish an electrostatic holding force between the platen and wafer, thereby “chucking” the wafer.

  • What is the principle of electrostatic chuck?

    Electrostatic chucks employ the attraction of opposite charges to hold both insulating and conducting substrates for a variety of microfabrication processes.
    Current flow through chuck insulating materials into a gripped substrate can yield variable release characteristics unless it is properly allowed for.

  • What are the different types of electrostatic chucks?

    Two types of electrostatic chucks are available: the Coulomb and Johnsen-Rahbek (J-R) types.
    These are distinguished by their dielectric characteristics and, therefore, the way the clamping force is generated.
    A Coulomb chuck functions like a conventional dielectric capacitor.

  • A manufacturing method for an electrostatic chuck, according to an embodiment of the present invention, comprises forming an alumina sintered body by sintering with ceramic raw material powder including at least about 99.5% by weight alumina in an inert atmosphere or a reduction atmosphere by a hot press method; and

A controller provides the clamp signal to the waveform generator, receives reports from the advisor module, and adjusts the clamp signal or provides a  Autres questions
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