In fire engineering, one-dimensional (1D) heat transfer is usually considered ? = k?c h2 (A 12) The temperature of the same semi-infinity body under
16 jan 2010 · (thus characterizing heat transfer rates) depend strongly on particle size and on its thermal diffusivity, ? The same
Transient Conduction Heat Transfer heat transfer analysis based on this idealization is called lumped system analysis T = T (x, L, k, ?, h, Ti, T?)
Alpha-1 Fluid is made with synthetic hydrocarbon oils, and has both the best heat transfer characteristics and the best low-temperature properties available
Heat leaves the warmer body or the hottest fluid, as long as there is a temperature difference, and will be transferred to the cold medium A heat exchanger
conductivity, volumetric heat capacity and the heat transfer coefficient for and Bransburg (4) and Gordon and Thorne (5) estimated ? using a thermal
Example: Perform scaling of the Fourier equation for heat conduction ?: Heat transfer coefficient: Intensity of sharing the heat by transport by
6 nov 2017 · Example 1: Unsteady Heat Conduction in a Semi-infinite solid ? thermal diffusivity what are the boundary conditions? initial conditions?
Surface heat transfer coefficient provided is an average value 3 Lumped parameter analysis m and a typical ? = 1 44 x 10-7m2/s for bio materials
heat transfer analysis based on this idealization is called lumped system equation with boundary and initial conditions: t T x T ∂ ∂ = ∂ ∂ α 1 2 2 (1)
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127917_3TransientHeatConduction.pdf M.BahramiENSC388(F09)TransientConductionHeatTransfer1
TransientHeatConduction
Ingeneral,temperatureofabodyvarieswithtimeaswellasposition. LumpedSystemAnalysisInteriortemperaturesofsomebodiesremainessentiallyuniformatalltimesduringaheat transferprocess.Thetemperatureofsuchbodiesareonlyafunctionoftime,T=T(t).The heattransferanalysisbasedonthisidealizationiscalledlumpedsystemanalysis. Considerabodyofarbitraryshapeofmassm,volumeV,surfaceareaA,densityʌand specificheatC p initiallyatauniformtemperatureTi .
Fig.1:Lumpedsystemanalysis.
Attimet=0,thebodyisplacedintoamediumattemperatureT ь (T ь >T i )withaheat transfercoefficienth.Anenergybalanceofthesolidforatimeintervaldtcanbe expressedas: heattransferintothebody duringdt=theincreaseintheenergyof thebodyduringdt hA(Tь
ͲT)dt=mC
p dT
Withm=ʌVandchangeofvariabledT=d(TͲTь
),wefind: dtVChA TTTTd p
Integratingfromt=0toT=T
i sVChAbe TTTtT pbt i /1
Solidbody
m(mass)
V(volume)
ʌ(density)
T i (initialtemp)
A(surfacearea)
h T ь
Q°=hA[T
ь
ͲT(t)]T=T(t)
M.BahramiENSC388(F09)TransientConductionHeatTransfer2
Fig.2:Temperatureofalumpsystem.
Usingaboveequation,wecandeterminethetemperatureT(t)ofabodyattimet,or alternatively,thetimetrequiredforthetemperaturetoreachaspecifiedvalueT(t). NotethatthetemperatureofabodyapproachestheambienttemperatureT ь exponentially. Alargevalueofbindicatesthatthebodywillapproachtheenvironmenttemperatureina shorttime. bisproportionaltothesurfacearea,butinverselyproportionaltothemassandthe specificheatofthebody.
Thetotalamountofheattransferbetweenabodyandits
surroundingsoveratime intervalis: Q=mC p [T(t)-T i ]
ElectricalAnalogy
Thebehavioroflumpedsystems,showninFig.2canbeinterpretedasathermaltime constant bCRVChA tttpt 11 whereR t istheresistancetoconvectionheattransferandC t isthelumpedthermal capacitanceofthesolid.AnyincreaseinR t orC t willcauseasolidtorespondmoreslowly T(t) t T ь T i b 1 b 2 b 3 b 3 >b 2 >b 1 M.BahramiENSC388(F09)TransientConductionHeatTransfer3 tochangesinitsthermalenvironmentandwillincreasethetimerespondrequiredto reachthermalequilibrium.
Fig.3:Thermaltimeconstant.
CriterionforLumpedSystemAnalysis
Lumpedsystemapproximationprovidesagreatconvenienceinheattransferanalysis.We wanttoestablishacriterionfortheapplicabilityofthelumpedsystemanalysis.
Acharacteristiclengthscaleisdefinedas:
AVL c AnonͲdimensionalparameter,theBiotnumber,isdefined: body theof surface at the resistance convectionbody e within thresistance conduction /1/body e within thconductionbody theof surface at the convection h kLBiT
LkThBikhLBi
ccc TheBiotnumberistheratiooftheinternalresistance(conduction)totheexternal resistancetoheatconvection. Lumpedsystemanalysisassumesauniformtemperaturedistributionthroughoutthe body,whichimpliesthattheconductionheatresistanceiszero.Thus,thelumpedsystem analysisisexactwhenBi=0. It isgenerallyacceptedthatthelumpedsystemanalysisisapplicableif 1.0Bi ttp t
CRhAVC
U W M.BahramiENSC388(F09)TransientConductionHeatTransfer4 Therefore,smallbodieswithhighthermalconductivityaregoodcandidatesforlumped systemanalysis. Notethatassuminghtobeconstantanduniformisanapproximation.
Example1
Athermocouplejunction,whichmaybeapproximatedbyasphere,istobeusedfor temperaturemeasurementinagasstream.Theconvection heattransfercoefficient betweenthejunctionsurfaceandthegasisknowntobeh=400W/m 2 .K,andthe junctionthermophysicalpropertiesarek=20W/m.K,C p =400J/kg.K,andʌ=8500kg/m 3 . Determinethejunctiondiameterneededforthethermocoupletohaveatimeconstantof
1s.Ifthejunctionisat25°Candisplacedinagasstreamthatisat200°C,howlongwillit
takeforthejunctiontoreach199°C?
Assumptions:
1. Temperatureofthejunction
isuniformatanyinstant.
2. Radiationisnegligible.
3. Lossesthroughtheleads,byconduction,arenegligible.
4. Constantproperties.
Solution:
Tofindthediameterofthejunction,wecanusethetimeconstant: ppt CD
DhVChA611
3 2 S U W u Rearrangingandsubstitutingnumericalvalues,onefinds,D=0.706mm. Now,wecancheckthevalidityofthelumpedsystemanalysis.WithL c =r 0 /3 leads
Thermocouplejunction
T i =25°C k=20W/m.K C p =400J/kg.K
ʌ=8500kg/m
3
Gasstream
T ь =25°C h=400W/m 2 .K d M.BahramiENSC388(F09)TransientConductionHeatTransfer5
OK. is analysis Lumped1.01035.2
4 khLBi c Bi<<0.1,therefore,thelumpedapproximationisanexcellentapproximation.
ThetimerequiredforthejunctiontoreachT=199°Cis
stTtTTT btVChAbe TTTtT ipbt i 2.5ln 1 f f f f U TransientConductioninLargePlaneWalls,LongCylinders,andSpheres Thelumpedsystemapproximationcanbeusedforsmallbodiesofhighlyconductive materials.But,ingeneral,temperatureisafunctionofpositionaswellastime. Consideraplanewallofthickness2L,alongcylinderofradiusr 0 ,andasphereofradiusr 0 initiallyatauniformtemperatureT i . Fig.4:SchematicforsimplegeometriesinwhichheattransferisoneͲdimensional. x0InitiallyatT =T i L
Planewall
LongcylinderInitiallyat
T=T i r
Sphere
rInitiallyat T=T i r 0 r 0 T ь h M.BahramiENSC388(F09)TransientConductionHeatTransfer6 Wealsoassumeaconstantheattransfercoefficienthandneglectradiation.The formulationoftheoneͲdimensionaltransienttemperaturedistributionT(x,t)resultsina partialdifferentialequation (PDE),whichcanbesolvedusingadvancedmathematical methods.Forplanewall,thesolutioninvolvesseveralparameters:
T=T(x,L,k,ɲ,h,T
i ,T ь ) whereɲ=k/ʌC p .Byusingdimensionalgroups,wecanreducethenumberofparameters. W T T,,Bix Tofindthetemperaturesolutionforplanewall,i.e.Cartesiancoordinate,weshouldsolve theLaplace'sequationwithboundaryandinitialconditions: tT xT 1 22
(1)
Boundaryconditions:
> @ f w w w wTtLThxtLTkttT,,,0,0(2a)
Initialcondition:T(x,0)=T
i (2b)
So,onecanwrite:
22
X where, numberFourier numberBiot distance essdimensionlre temperatuessdimensionl,, 2
LtkhLBiLxXTTTtxTtx
i f f Thegeneralsolution,tothePDEinEq.(1)withtheboundaryconditionsandinitial conditionsstatedinEqs.(2),isintheformofaninfiniteseries: XeA n nn n cos 2 1 Table11Ͳ1,Cengle'sbook,listssolutionsforplanewall,cylinder,andsphere.
Therearetwoapproaches:
1.Usethefirsttermoftheinfiniteseriessolution.ThismethodisonlyvalidforFourier
number>0.2
2.UsetheHeislerchartsforeachgeometryasshowninFigs.
11Ͳ15,11Ͳ16and11Ͳ17.
M.BahramiENSC388(F09)TransientConductionHeatTransfer7
UsingtheFirstTermSolution
Themaximumerrorassociatedwithmethodislessthan2%.Fordifferentgeometrieswe have:
2.0where//sinexp,,/exp,,/cosexp,,
01012
110102
111
2 11 f f f f f f W O O W O T O W O T O W O T rrrrATTTtrTtxrrJATTTtrTtxLxATTTtxTtx ispherei cylinderi wall whereA 1 andʄ 1 canbefoundfromTable11Ͳ2Cengelbook.
UsingHeislerCharts
Therearethreecharts,Figs.11Ͳ15to11Ͳ17,oneassociatedwitheachgeometry:
1. ThefirstchartistodeterminethetemperatureatthecenterT
0 atagiventime.
2. Thesecondchartistodeterminethetemperatureatotherlocationsatthesame
timeintermsofT 0 .
3. Thethirdchartistodeterminethetotalamountofheattransferuptothetimet.
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