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HI-REL die attach adhesives need to be ionically clean and pure, low bleed-out and high strength on Au, whether on ceramic substrates, SMD or diode contact
Die attach material selection and process implementation play crucial roles in any microelectronic assembly The chosen attach methods
The bonding mechanism for a silver-lead borate glass adhesive, used as a die bonding material in microelectronics packaging, was investigated
Die attach material selection and process implementation play crucial roles in any microelectronic assembly The chosen attach methods ultimately affect die
CHAPTER 6 Analysis of High Temperature Die Attach Materials under established technology for die-attach joints in the microelectronics industry,
Index Terms — die attach process, bond line thickness (BLT), bonding force The authors are with the Institute of Microelectronics, Agency for