[PDF] [PDF] 20 to 250 kPa, Manifold absolute pressure sensor, on-chip - NXP

25 juil 2017 · The MPX4250A/MPXA4250A Manifold Absolute Pressure (MAP) sensor for high-level analog output signal that is proportional to the applied



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[PDF] MAP Sensor - Ecotron

The MAP sensor output is an analog voltage, in 0-5V The voltage is linear proportional to the absolute pressure measured The above figure shows the linear 



[PDF] Sense & Control Data Sheet KP216H1416 MAP - Infineon

Sense Control Data Sheet Revision 1 1, 2010-09-01 KP216H1416 Analog Absolute Pressure Sensor MAP Analog Manifold Air Pressure Sensor IC 



[PDF] Virtual Sensor For Automotive Engine To Compensate For The Map

Read an input on analog pin , prints the result to the serial monitor, by serial Arduino code Attach the center pin of a sensor to analog pin of Arduino, and the 



[PDF] Analog absolute pressure sensor, 20 to 550 kPa - NXP

29 mai 2019 · This sensor is ideal for many automotive applications such as manifold air pressure (MAP), turbo MAP, comfort seating and other applications 



[PDF] 20 to 250 kPa, Manifold absolute pressure sensor, on-chip - NXP

25 juil 2017 · The MPX4250A/MPXA4250A Manifold Absolute Pressure (MAP) sensor for high-level analog output signal that is proportional to the applied



[PDF] TESTS DH: MANIFOLD ABSOLUTE PRESSURE (MAP) SENSOR

1/19/2021 Tests DH: Manifold Absolute Pressure (MAP) Sensor, Analog ( Computers and Control Systems) - ALLDATA Repair



[PDF] 52473 - Integrated Air Pressure Sensor with Analog Interface - Avnet

6 nov 2017 · Integrated Air Pressure Sensor with Analog Interface 524 73 air pressure (BAP ), manifold air pressure (MAP) or spe- cific industrial and 



[PDF] MAP sensor signal glitches, O2 sensor flange gasket - MOTOR

we'll discuss MAP sensor testing, finding an oxy- ty systems, a bad Toyota MAP sensor can cause bucking from a typical analog MAP sensor during a snap-

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MPXA4250A6U 98ASB17756CMPXA4250AC6U/C6T1 98ASB17757CMPX4250A 98ASB42793BMPX4250AP 98ASB42796BCASE 482-01CASE 482A-01CASE 867-08CASE 867B-04

Pins 4, 5 and 6 are NO CONNECTS for unibody package devices.Sensing ElementVOUTVCC GNDThin Film Temperature Compensation and Gain Stage #12 (Unibody)2 (Small outline package)4 (Small outline package)Gain Stage #2 and Ground Reference Shift Circuitry1 (Unibody)3 (Unibody)3 (Small outline package)Pins 1, 5, 6, 7, and 8 are NO CONNECTSfor small outline package devices.

Wire bondDieP1Fluoro siliconedie coatEpoxy caseRTV die bondSealed vacuum referenceLead frameStainless steelmetal cover

+5.1 V1.0 µF0.01 µF470 pFGNDVCCVoutIPSOutput

Output (Volts)5.04.54.03.53.02.52.01.51.00.500102030405060708090100110120130140150160170180190200210220230240250260Pressure in kPa0Transfer Function:Vout = VCCx (P x 0.004 - 0.04) ± Error VCC = 5.1 VdcTemperature = 0 °C to 85 °CMAXMINTYP

VCC = 5.1 ± 0.25 VdcNominal transfer value:VOUT = VCC) x (P × 0.004 - 0.04) ± (Pressure error × Temp. Factor × 0.004 x VCC

Temp °C-400 to 85+125Temperature in °C4.03.02.00.01.0-40-20020406014012010080Temperatureerror factor

Multiplier313

0.66016.760.060 TYP 8X1.520.100 TYP 8X2.540.100 TYP 8X2.540.3007.62inchmmSCALE 2:1

DIMMINMAXMINMAXMILLIMETERSINCHESA10.540.42597.01514.0B10.540.42597.01514.0C12.700.52012.31005.0D0.960.04270.1830.0G0.100 BSC2.54 BSCH0.0020.0100.050.25J0.0090.0110.230.28K0.0610.0711.551.80M0 7 0 7 N0.4440.44811.2811.38S0.7090.72518.0118.41NOTES:1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.DIMENSION A AND B DO NOT INCLUDE MOLDPROTRUSION.4.MAXIMUM MOLD PROTRUSION 0.15 (0.006).5.ALL VERTICAL SURFACES 5 TYPICAL DRAFT.SDG8 PL4581SBM0.25 (0.010)AST-A--B-CMJKPIN 1 IDENTIFIERHSEATINGPLANE-T-NVWV0.2450.2556.226.48W0.1150.1252.923.17

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